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Chao-Shun Yang

update date : 2025-07-05
Chao-Shun Yang

Professor: Chao-Shun Yang, Assistant Professor

Education: Ph.D. in Telecommunications, National Chiao Tung University

Office Location: Electrical Engineering Building, Room 213

Extension Number: 5209

Email: csyang@mail.mcut.edu.tw

Office Hour:

Specialties: 5G Package Antenna Design, 77GHz Automotive Radar Antenna Design, RFIC Measurement Technology, Millimeter-Wave Antenna System Measurement Technology

Experience: Powertech Technology Inc. Package Simulation Department (2019/07~2021/7)

            Chien-Chun Technology System and Hardware Antenna Design Division (2018/11~2019/5)

            National Nano Device Laboratories, NARLabs (2015/1~2018/10)

            National Chip Implementation Center, NARLabs (2009/2~2011/7)

Academic/Thesis Research Information

A. International Journals

  1. Hsi-Tseng Chou, Zhao-He Lin, Ding-Bing Lin, Chao-Shun Yang, Pin-Zhong Shen, Chi-Liang Pan, “Considerations of Dielectric Property Deviation and Mechanical Limitations for Antenna-in-Package Fabrication by SiP-Based Stacked Organic Dielectric Substrates at Millimeter-Wave Frequencies”, IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION, 70, (2), pp.1309, pp.1319, 2022, [SCIE & Non-EI]

B. International Conferences

  1. Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies 2021 6/1~7/4 ECTC (Electronic Components and Technology Conference) virtual conference
  2. 5G Antenna in Module (AiM) Architecture to Realize a Large Active Antenna Array with Unequal Shortest Microstrip Paths to Minimize Feeding Loss by Using True-delay Line-based Phase Shifters at Millimeter-Wave Frequencies 2021 6/1~7/4 ECTC (Electronic Components and Technology Conference) virtual conference
  3. Considerations of SiP based Antenna in Package/ Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications 2021 6/1~7/4 ECTC (Electronic Components and Technology Conference) virtual conference
  4. One-dimensional Steerable End-fire Orthogonal Beams for 5G Millimeter Wave Applications by L-shape Antenna Element Arrangement in Antenna-in-Packaging Design 2020 6/1~7/4 ECTC (Electronic Components and Technology Conference) virtual conference
  5. Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process 2020 6/1~7/4 ECTC (Electronic Components and Technology Conference) virtual conference
  6. A 2.5D Wafer-level CMOS-IPD Rectenna Using Wide-Range Efficiency and Self-biasing Topology for a RF Wireless Power Harvesting System •  2018 Asia-Pacific Microwave Conference (APMC)
  7. Gap-Coupled Miniaturized Antenna on IPD Process for WLAN Tablet Computer Proceedings of ISAP2016, Okinawa, Japan
  8. A Compact Size and High Efficiency CMOS-IPD Rectenna Using 2.5D Wafer-level Packing for a Wireless Power Harvesting System Proceedings of the 46th European Microwave Conference
  9. Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic, Memory and Sensor Analogy Circuitry for Internet of Things 2015 IEEE International Electron Devices Meeting (IEDM)

C. Research Projects

  1. Electromagnetic Interference Prevention for Memory Components in High-Speed Digital Circuit Boards, Nanya Technology Corporation 2022/01/01~2022/09/30
  2. Glass Antenna Unit Structure Design, Industrial Technology Research Institute, 2022/09/23~2022/09/30

D. Professional Certifications

  1. National Chip Implementation Center, NARLabs: High-Frequency Instrument Measurement Technology Certification No. 980002
  2. National Chip Implementation Center, NARLabs: High-Frequency Instrument Measurement Technology Certification No. 1000001
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