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楊超舜

最後更新日期 : 2024-10-04
楊超舜

教　　師：楊超舜  助理教授

學　　歷：國立交通大學電信所博士

辦公地點：電機館213室

分機號碼：5209

電子郵件：csyang@mail.mcut.edu.tw

Office Hour：

專　　長：5G封裝天線設計、77GHz車用雷達天線設計、RFIC量測技術、毫米波天線系統量測技術

經　　歷：力成科技 封裝模擬部(2019/07~2021/7)

            千竣科技 系統暨硬體天線設計處(2018/11~2019/5)

            國研院 國家奈米元件實驗室(2015/1~2018/10)

            國研院 國家晶片系統中心(2009/2~2011/7)

學術/論文研究資料

A.國際期刊

  1. Hsi-Tseng Chou, Zhao-He Lin, Ding-Bing Lin, Chao-Shun Yang, Pin-Zhong Shen, Chi-Liang Pan,“Considerations of Dielectric Property Deviation and Mechanical Limitations for Antenna-in-Package Fabrication by SiP-Based Stacked Organic Dielectric Substrates at Millimeter-Wave Frequencies”,IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION,70,（2）,pp.1309,pp.1319,2022,【SCIE ＆非EI 】

B.國際研討會

  1. Sensitivity of Dielectric Substrate Property Discrepancy and Metal Microstrip Roughness to the Electronic Characteristics of Antenna-in-Packaging for 5G Applications at Millimeter-Wave Frequencies 2021 6/1~7/4 ECTC(Electronic Components and Technology Conference) virtual conference
  2. 5G Antenna in Module (AiM) Architecture to Realize a Large Active Antenna Array with Unequal Shortest Microstrip Paths to Minimize Feeding Loss by Using True-delay Line-based Phase Shifters at Millimeter-Wave Frequencies 2021 6/1~7/4 ECTC(Electronic Components and Technology Conference) virtual conference
  3. Considerations of SiP based Antenna in Package/ Module (AiP/AiM) Design at Sub-Terahertz Frequencies for Potential B5G/6G Applications 2021 6/1~7/4 ECTC(Electronic Components and Technology Conference) virtual conference
  4. One-dimensional Steerable End-fire Orthogonal Beams for 5G Millimeter Wave Applications by L-shape Antenna Element Arrangement in Antenna-in-Packaging Design 2020 6/1~7/4 ECTC(Electronic Components and Technology Conference) virtual conference
  5. Active Antenna Subsystem Integration of Steerable Boresight Radiation Beams for 5G Millimeter Wave Applications by System-in-Packaging Process 2020 6/1~7/4 ECTC(Electronic Components and Technology Conference) virtual conference
  6. A 2.5D Wafer-level CMOS-IPD Rectenna Using Wide-Range Efficiency and Self-biasing Topology for a RF Wireless Power Harvesting System •  2018 Asia-Pacific Microwave Conference (APMC)
  7. Gap-Coupled Miniaturized Antenna on IPD Process for WLAN Tablet Computer Proceedings of ISAP2016, Okinawa, Japan
  8. A Compact Size and High Efficiency CMOS-IPD Rectenna Using 2.5D Wafer-level Packing for a Wireless Power Harvesting System Proceedings of the 46th European Microwave Conference
  9. Low-Cost and TSV-free Monolithic 3D-IC with Heterogeneous Integration of Logic,Memory and Sensor Analogy Circuitry for Internet of Things 2015 IEEE International Electron Devices Meeting (IEDM)

C.研究計畫

  1. 記憶體元件於高速數位電路板之電磁干擾防治，南亞科技股份有限公司 111/01/01~111/09/30
  2. 玻璃天線單元結構設計，工業技術研究院，111/09/23~111/09/30

 

 

 

D.專業證照

  1. 國研院國家晶片系統設計中心:高頻儀器量測技術認證晶訓字第 980002號
  2. 國研院國家晶片系統設計中心:高頻儀器量測技術認證晶訓字第1000001號
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